Flexible Electronics News

Fraunhofer FEP to Present at 2018 FLEX

Will highlight novel, highly productive process for robust layers on flexible materials.

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By: DAVID SAVASTANO

Editor, Ink World Magazine

The Fraunhofer Institute for Organic Electronics, Electron Beam and Plasma Technology FEP will be presenting research advances in the area of high-rate coating at the 2018 FLEX conference in Monterey, CA from Feb. 12 – 15, 2018.   Wearables, arched displays and buildings facades increasingly require bendable, flexible surfaces with tailored functionality and properties. These coating functionalities include the reduction of gas permeation, protection against chemicals, radiation and mechanical...

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